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December 9, 2011 -- Honeywell Microelectronics will use Tezzaron's 3D stacking on Honeywell’s S150 process on radiation-hardened (rad-hard) aerospace electronics components.
Honeywell will use Tezzaron's die-to-wafer and wafer-to-wafer bond packaging processes to increase circuit density without migrating to a smaller node, consume less power in the same package, and allow greater redundancy for repair schemes.
Robert Patti, CTO of Tezzaron, says that "memory can be integrated vertically rather than embedded in the logic die. The current practical limit is around 32 Megabits, but 3D could put as much as 4 Gigabits of high-quality DRAM onto a single rad-hard chip." The technology could even enable MEMS devices that incorporate radiation-hardened logic.
Honeywell Microelectronics provides reliable, radiation-hardened electronics to the aerospace industry and other radiation-prone environments. Website: http://www.honeywellmicroelectronics.com/.
Tezzaron Semiconductor creates 3D packaging technology. Learn more at http://www.tezzaron.com/.
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