December 20, 2011 -- Aries Electronics, interconnect manufacturer, debuted AR4HT Series chipscale package (CSP) test sockets that accept any area-array device for testing up to 200°C.
A low-profile 0.45mm contact structure (compressed) enables good compliance for reliable ATE testing and burn-in test. In addition to BGA, LGA, QFN, CSP, MLCC, and PoP testing, the AR4HT sockets accommodate bumped die with full and partial arrays. ICs can have 0.4mm or greater pitch, and the sockets accept mixed-pitch environments.
The sockets can be used for high-temperature device test and burn-in, as well as testing high-frequency bandwidth, low inductance, and high current conditions. Sample applications include testing packages for military, aerospace, and geophysical electronics, as well as research and development work. Socket operating temperature is -55°C to +200°C. Life expectancy exceeds 10,000 actuations.
The interposer set is comprised of silver particles within a silicon elastomer with a proprietary polyimide core. Initial contact force is 20 to 30 grams per lead.
AR4HT sockets are available in custom sizes and configurations.
Aries Electronics Inc. manufactures custom and standard interconnection and packaging products used worldwide for a variety of electronics applications. For additional information, go to http://www.arieselec.com, Data sheet # 23026 http://www.arieselec.com/Web_Data_Sheets/23026/23026.htm.
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