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November 15, 2011 -- Nanotechnology accelerator SVTC Technologies partnered with SUSS MicroTec on wafer-level packaging (WLP) for micro electro mechanical systems (MEMS) and 3D IC bonding.
The companies will focus on developing "new processes and solutions in the field of wafer-level packaging," said Frank P. Averdung, president and CEO, SUSS MicroTec AG, noting SVTC's complementary skill set in research and innovation. The companies will jointly develop and characterize new lithography and wafer-bonding technologies.
SUSS MicroTec consigned alignment and bonding equipment to one of SVTC’s advanced cleanrooms in San Jose, CA. Mutual customers will be able to try equipment and develop new processes at the cleanroom. SVTC offers full-scale 8" and 12" process capabilities, advanced CMOS and non-CMOS equipment, analytical services, development support tools and commercialization services. The company is ISO 9001, ISO 13485 and ITAR registered.
SVTC Technologies provides technology development and commercialization services via in-house capabilities and a select network of strategic partners. More information can be found at www.svtc.com.
SUSS MicroTec, listed on TecDAX of Deutsche Börse AG, makes equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.
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