November 11, 2011 -- Fujikura Ltd. and FlipChip International LLC (FCI) released ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.
ChipletT and ChipsetT package products are based on Fujikura's flex-based laminate embedded die "WABE Technology." The roll-to-roll (R2R) flex fabrication process reportedly reduces costs and package profile (<250µm thick). The increased functional density in embedded packages allows more innovative designs as well as lower power consumption and better reliability, the companies report.
This technology can be applied to 3D packages, system in package (SiP), re-distributed layers (RDL), fan-in, fan-out (FIWLP and FOWLP), through silicon via (TSV) and NanoPillar packaging technologies.
ChipletT and ChipsetT target smartphone and tablet semiconductor packaging needs, as well as use in medical diagnostic equipment, server farms, automotive electronics, security systems, sensors, and photovoltaics components.
FCI and Fujikura will be exhibiting this new Product line at the Productronica Show in Munich, Germany, November 15-18, Hall A2, Booth 517.
FlipChip International LLC (FCI) provides products and services for the wafer bumping and wafer scale packaging semiconductor market. FCI is a subsidiary of RoseStreet Labs LLC, a supplier of products and services for semiconductor, life science, and renewable energy markets. Learn more at www.flipchip.com and www.rosestreetlabs.com.
Fujikura Ltd. is a global supplier of optical transmissions systems, network systems, electronic materials, power systems, coated wires, magnet wires, electronic materials for equipment and metallic materials. Internet: www.fujikura.com.
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