September 13, 2011 -- SEMICON Europa 2011 will take place October 11-13 at Messe Dresden in Dresden, Germany. The event covers new technologies and products for advanced microelectronics manufacturing including semiconductors and semiconductor packaging, micro electro mechanical systems (MEMS), printed/organic and plastic electronics, power electronics, and other electronics fields.

This year’s SEMICON Europa includes the most co-located events the program has ever had: the 13^th European Manufacturing Test Conference, the Advanced Packaging Conference, the International MEMS/MST Industry Forum, and the Plastics Electronics Conference and Exhibition (PE2011).

More than 60 presentations will be given on the TechARENA presentation stage at SEMICON Europa. Topics range from packaging and 3D IC manufacturing to lithography, metrology, automation, test, materials advances, and more. Sessions will be dedicated to issues specific to MEMS/MST and secondary equipment. Presenters hail from Altis, Analog Devices, Bosch, Colybris, CSR, Freescale, GLOBALFOUNDRIES, Infineon, Intel, IBM, Lfoundry, Micron, Nanium, Nokia, Numonyx, NXP, Osram, STMicroelectronics, Texas Instruments, Thales, and X-Fab.

SEMICON Europa will host the 15^th European Fab Manager's Forum, covering improving manufacturing productivity and extending the life of existing fabs through new technologies and markets. Sessions will focus on market dynamics, clustering, power semiconductors, and advanced 200/300mm production. Michael Campbell, senior vice president of engineering, Qualcomm; and Martin Hierholzer, vice president and general manager, Infineon will keynote.

For SEMICON Europa keynote presentation, sessions, and short courses information, and to register, visit www.semiconeuropa.org.