June 21, 2011 - PRNewswire -- EV Group (EVG), wafer bonding and lithography equipment supplier, added an in-line metrology module for its EVG850TB and EVG850DB automated temporary bonding and debonding systems.
EVG's integrated in-line metrology module detects thickness variation (TTV) of the carrier wafer, adhesive layer, bonded stack and thinned wafer; bow/warp of the bonded stack; and voids in the bond interface during wafer bonding/de-bonding.
In-line process control for thin-wafer processing enables IC manufacturers to reduce defects and wafer breakage, especially in ramp-up production of through silicon vias (TSV) and other 3D IC technologies. Integrated metrology could enable different companies to perform thin-wafer packaging steps to the same specifications, said Thorsten Matthias, business development director at EVG, which opens up "an entirely new supply chain model for TSV manufacturing...integrated device manufacturers (IDMs) and foundries can perform temporary bonding, thinning and backside processing, while outsourced semiconductor assembly and test (OSAT) companies can do debonding before dicing and packaging."
Since device wafers undergo many process steps prior to thin-wafer processing, it is essential that the wafer thinning and bonding/debonding process do not contribute to yield loss, EVG points out. Thinning and processing wafers on a carrier wafer, then debonding the carrier for final packaging steps, creates multiple breakage opportunities.
EVG has built thin-wafer temporary bonding/debonding tools for more than 10 years, said Dr. Matthias, calling the in-line metrology option the "next level" for this technology.
Markus Wimplinger, corporate technology development and IP director, will present "In-line IR metrology for high-volume temporary bonding applications" at the SEMATECH Workshop on 3D Interconnect Technology, July 13, 2011, in San Francisco, CA.
EV Group (EVG) provides wafer processing products for semiconductor, MEMS and nanotechnology applications. More information at www.EVGroup.com.