Semiconductors 2011 P
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Mon Sep 26 11:29:00 CDT 2011 -- Invensas demos DFD implementation of its xFD technology
Invensas president Simon McElrea explains the company's new wire bond-based multi-die face-down (xFD) packaging technology, demo'd at this year's Intel Developer Forum, and its advantages in terms of performance and manufacturing cost reductions. -
Tue Jul 05 11:19:00 CDT 2011 -- Elpida begins sampling 8Gb DDR3 SDRAM
Elpida Memory is now sampling a new 8Gb TSV DRAM consisting of four 2Gb layers based on TSV stacking technology. -
Fri Jun 17 09:25:00 CDT 2011 -- CSCD commissions curve tracers for on-wafer power device test
CT-3100/3200 Curve Tracers from Cascade Microtech will provide wafer-level measurement for the growing power device market. The curve tracer units complement CSCD's Tesla probe systems' high-voltage and high-current capabilities. -
Mon Jun 13 14:30:40 CDT 2011 -- New power MOSFET package from IRF minimizes form factor
ternational Rectifier, (IR, NYSE:IRF), power management technology provider, introduced a PQFN 2 x 2mm with <1mm profile package featuring its latest HEXFET MOSFET silicon. The new package is ultra-compact, high density and efficient for lower-power applications. -
Thu May 26 12:50:40 CDT 2011 -- Asian foundry inspects micro bumps with Camtek systems
Camtek Ltd. (NASDAQ and TASE: CAMT) received repeat automatic optical inspection (AOI) orders from an Asia-based foundry doing advanced micro bump inspection and metrology. Challenges arise in measuring such small bumps used in advanced packages, including efficiently handling huge amounts of data. -
Thu May 05 09:55:00 CDT 2011 -- NXP metrology labs tap Tektronix for test/measurement equip calibration and repair
NXP named Tektronix Service Solutions to provide calibration and repair services for all test and measurement instruments at NXP's production and development sites in the Netherlands. -
Tue Apr 26 15:10:20 CDT 2011 -- Asian semiconductor packaging specialist orders SPTS etch, PVD and CVD technologies for TSV
SPP Process Technology Systems (SPTS) won a multi-system order for its Sigma PVD, Omega Etch and Delta CVD wafer processing systems from a leading outsourced semiconductor assembly and test (OSAT) provider in the Asia-Pacific region.
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