Video: Readiness of 3D technologies from a materials perspective

07/23/2010

(July 23, 2010) -- In this video interview shot at SEMICON West 2010, Mark Privett, Brewer Science, says that new technologies allow use of higher temperatures as well as room-temperature processes, such as wafer de-bonding. The 3D packaging industry is nearly ready for high-volume, yet still without industry standards.

To see the company's earlier 2010 interview, recorded at the ConFab with CTO Tony Flaim, click here: http://www.electroiq.com/index/display/semiconductors-article-display/2383506614/articles/solid-state-technology/semiconductors/industry-news/business-news/2010/may/confab-video__end.html

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Video: Readiness of 3D technologies from a materials perspective

Editors' Picks

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LIVE NEWS FEED

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-Blue Coat Acquires Netronome's SSL Inspector Appliances

ATMI gives $ 2 million gift to UC/Berkeley for research in mobile device efficiency

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Lifting the veil on silicon interposer pricing

Singapore IME launches 2.5D silicon interposer MPW

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