(March 20, 2009) BOSTON The SMTA Boston Chapter will cohost a technical presentation with IMAPS on April 21, preceding the opening of the SMTA Boston Academy, April 22-23. SMTA/IMAPS will present "Manufacturing & Reliability Challenges with QFN Packages in Pb and Pb-Free Environments," with speaker Cheryl Tulkoff, CRE, senior member of the technical staff at DfR (Design for Reliability) Solutions. The Boston Academy will include seven courses on SMT, packages and components, PCBs, and lead-free and REACH.
In "Manufacturing & Reliability Challenges with QFN Packages in Pb and Pb-Free Environments," presented at Textron Defense Systems in Wilmington, MA. One of the fastest growing package types in the electronics industry today is the quad flat pack no lead (QFN), comprising an overmolded leadframe with bond pads exposed on the bottom and arranged along the periphery of the package. While the advantages of QFNs are well documented, DfR Solutions considers QFN as a next-generation technology for non-consumer electronic OEMs due to concerns with manufacturability, compatibility with other OEM processes, and reliability. QFN acceptance, especially in long-life, severe-environment, high-rel applications, is currently limited. This presentation is designed to review the specific concerns in relation to design and process designs by CMs and OEMs and provide possible mitigations or solutions to allow the reliable introduction of QFN packaged components. Cheryl Tulkoff has over 15 years of experience in electronics manufacturing with an emphasis on failure analysis and reliability. She has worked in both circuit card fabrication and assembly and semiconductor fabrication processes. Tulkoff earned her bachelor of mechanical engineering degree from Georgia Tech. She is a published author, experienced public speaker and a senior member of ASQ and IEEE. She volunteers with several organizations specializing in encouraging pre-college students to pursue careers in science, technology, engineering, and math (STEM). Attend the presentation at Textron Defense Systems, 201 Lowell Street, Wilmington, MA, (978) 657-5111. All attendees MUST be US Citizens. Pre-registered attendees, please bring driver's license; late (non-pre-registered) attendees must bring a passport or birth certificate to attend this SMTA/iMAPs meeting.
The SMTA Boston Academy will be held in Boston April 2223, in conjunction with Electronics New England, including Nepcon East.
SMT Editorial Advisory Board member S. Manian Ramkumar, Ph.D., will teach "SMT Process Fundamentals for Tin-Lead, Lead-Free, and Mixed Assembly." The course covers SMT and mixed assembly processes, such as PCB types, assembly methods, component types, defects, troubleshooting, and process control. It is an introductory course with a comparison of leaded and lead-free processes, and tips for equipment and materials evaluation. Ramkumar also will teach "Advanced Component Packages and Processes," covering terminology, classification, construction, and assembly of packages. Embeddeds, QFNs, package-on-package (PoP), BGAs, CSPs, CGAs, flip chips, WLPs, and other advanced packages will be discussed.
Nathan Blattau, Ph.D., DfR Solutions, will give "Next Generation Technologies in Electronic Packaging and Production," a course that deals with selection, review, and validation of new technologies. It helps attendees sort through the confusing and fragmented product data available to identify useable packaging, PCB, thermal management, and circuit assembly technologies; and discusses how to implement them. It targets design personnel, and reliability and product engineers. Blattau also will teach "The Reality of Lead-free Reliability," on RoHS, components, tin whiskers, solderability platings, PCB robustness, and other risks of lead-free assembly.
Andrew Mawer, Freescale Semiconductor, will present "Common Failure Modes in Electronic Packages and Assemblies and How to Avoid Them." The class will cover component-level and second-level interconnect failure modes, as well as those experienced in-operation and at the system level. Soldering is the focus. Mawer also will teach "Construction, PCB Design, and Assembly of BGA and Leadless Packages for Pb-Free," which covers the evolution of BGA and other area array packages, including enhancements to reliability, thermal compatibility, density, and other factors.
Jim Dills, GoodBye Chain Group, will teach "Aspects and Impacts of REACH: Overview of Current and Future REACH Substances of Very High Concern (SVHCs)." This course includes an introduction to the REACH legislation, its implications, preparation/conformance strategies, and case studies where REACH disclosures have been implemented.
To register for any of the courses, visit www.smta.org/education/academy/academy.cfm.