TSV First and Last: Through-Si Via Technologies for 3D SIC and 3D WLP

Part 2
By Jan Provoost and Eric Beyne, IMEC
3D SIC uses a via first approach to connect circuits at the global IC level. 3D WLP uses a via last approach to connect circuits at the bond pad level. Both these approaches occupy a separate space on the 3D roadmap. This article, presented in two parts, offers both options and describes the process to realize them.

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