SCHOTT Electronic Packaging offers a hermetic transistor outline (TO) for fiber channel applications of 17 gigabits/second and beyond. The TO PLUS Line reportedly overcomes the normal limitations of a TO by combining glass and packaging design aspects. Up to 6 pins, including higher frequency and DC (electrical) ports, most of the necessary electronics can be packaged into a regular TO footprint, rather than resorting bulky complex hybrid packages. Along with these additional pins, these products are said to achieve excellent RF performance in a standard footprint. Further tests are underway at SCHOTT Electronic Packaging to enable the TO to perform beyond 17G and potentially serve the 25G regime. SCHOTT North America, Inc., Elmsford, NY; www.us.schott.com
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