The PE-200-RIE Convertible, from Plasma Etch, is a convertible RIE configuration of the companies PE-200 plasma etching/cleaning system. Designed for anisotropic etching of nitrides, oxides, and polyimide, the system features a 13 × 13″water-cooled RIE electrode for substrate processing.
A movable parallel plate ground electrode is offered on a unique shelving assembly so that the distance between the powered electrode to the ground can be varied by ½ increments. In addition to anisotropic etching capabilities, another complete electrode assembly is provided with the PE-200-RIE, allowing for conversion to isotropic applications. In this case, three 13 × 13″electrodes with 3″ fixed spacing is provided to place parts for uniform plasma cleaning/etching.
The PE-200-RIE includes a 300W 13.56 MHz RF power supply with automatic matching and two mass-flow controllers. The system is completely PLC controlled, and features a touch-screen display for user configuration setup and operation. Up to 20 complete process sequences can reportedly be stored and dual steps can be programmed. Applications include medical devices, solar cells, optics, printed circuit boards, connectors, MEMs, wafer level packaging as well as many other related semiconductor processes. Plasma Etch Inc. Carson City, NV. www.plasmaetch.com
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