The BONDJET BJ820, from Hesse & Knipps, is a high-speed, fully automatic wedge bonder for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform — including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive — using aluminum or gold wire or ribbon. It reportedly offers bond speeds up to 7 wires-per-second.
With axis repeatability of 1µm at a balanced encoder resolution of 20 nm, the BONDJET BJ820 provides increased process stability for reportedly reliable bonding of extremely small bond pads with a larger wire diameter. A 12" x 16.1" work area can double as two or more smaller stations to accommodate smaller products or substrates. Additionally, its 720 x 1250 mm footprint allows for easy integration into existing floor plan configurations or new concepts. Other capabilities include:
The BONDJET BJ820 will be showcased at SEMICON West. Booth 7357, West Hall Level 1.
Hesse & Knipps Paderborn, Germany www.hesse-knipps.com
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