Alchimer CEO Predicts Demise of Vapor Deposition Processes for TSVs by 2009

03/18/2008

(March 17 2008) Massy, France — After being appointed CEO of Alchimer SA, Steve Lerner immediately predicted the demise of vapor deposition processes for depositing nanoscale films in through silicon vias (TSVs) within a year. Steve Lerner is a technologist with 29 years' experience in semiconductor development and manufacturing. He founded advanced packaging and device companies Alpha Szenszor, GigSys, and CS2, and has held executive positions at Amkor, Swire, and AME.

Font Sizes:

Editors' Picks

Nanya implements 3D IC TSV technology for DDR3, future DDR4 devices

ASM Pacific Technology delivers 100 x 300mm leadframe packaging set up

3D TSV packages outgrow semiconductor industry by 10X

2012 ITRS update: Back-end packaging and MEMS

Roadmapping More than Moore: When the application matters

Contemporary semiconductor packaging experts open up on cost

TOP BLOG POSTS

Intel’s 22-nm Trigate Transistors Exposed

Lester the Lightbulb vs CFL and LED: The Saga Continues

IFTLE 88: Apple TSV Interposer rumors; Betting the Ranch; TSV for Sony PS-4; Top Chip Fabricators in Last 25 Years

Intel's (INTC) 2011 earnings, Q1 outlook, and executive reshuffle

Early 450mm orders: Tire-kicking or seat-warming?

IFTLE: MEPTEC 2.5, 3D and beyond

IEDM 2011: IBM displays via-middle TSV process for die stacking

LIVE NEWS FEED

FORM 8-K: LATTICE SEMICONDUCTOR FILES CURRENT REPORT

US Contract Award: Defense Logistics Agency grants Federal Contract worth $43,350.00 for "59--SEMICONDUCTOR DEVICE, DIODE"

VITESSE SEMICONDUCTOR REPORTS ACQUISITION BY DIRECTOR LAROSA (California)

VITESSE SEMICONDUCTOR REPORTS ACQUISITION BY DIRECTOR ROGAS (California)

VITESSE SEMICONDUCTOR REPORTS ACQUISITION BY DIRECTOR HANSON (California)

Advanced Packaging Recent Articles

imec, PVA Tepla demo 3D TSV void detection

Novati to use Ziptronix bonding tech for 3D assembly

Through-wafer Inspection for MEMS Devices — a Comparison

EV Group and Brewer Science Establish Ultra-thin Wafer Bonding Lab

Gone Fishing

Localized Cooling for Data Centers

Solder-free Connectors Using Buckled Pillars

Packaging Topics

Wafer Level Packaging

View Solid State Technology articles by topic, A-Z

Article Archive for Advanced Packaging.

SUBSCRIBE

FREE eNewsletters

I would like to receive eNewsletters on the following topics:

*

First Name

*

Last Name

*

Email Address

*

Country

* Required

Electronics Manufacturing News & Products

.

Advanced Packaging

.

Displays Manufacturing

.

LED Manufacturing

.

MEMS Manufacturing

.

Semiconductor Manufacturing

.

Please fill in the required fields above.

© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS

Please fill out the remaining fields to complete your registration.

First Name Last Name

Email

Job Title

Company

Country

By clicking 'Register' you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.

or

Or, login with your PennWell account:

or

Or, register with us using the form below:

First Name Last Name

Email

Password

Job Title

Company

Country

By clicking 'Register' you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.

Enter your email address below and click Submit to receive password reset instructions via email.

An email has been sent to .

Please follow the instructions in the email to change your password.

Your account has been created and you are now logged in.

It looks like you've already registered with . Please login below to link your accounts.

Thank you for registering. An email has been sent to with instructions on how to verify your account.

The specified email address, , needs to be verified in order to login.

An email has been sent to with instructions on how to verify your account.

/content/eiq-2/en/articles/ap/2008/03/alchimer-ceo-predicts-demise-of-vapor-deposition-processes-for-tsvs-by-2009.resendverification.html