Included in the acquisition is the patented Fast Moiré Interferometer (FMI) technology for rapid 3D inspection. Continued development of the FMI head and flip chip substrate equipment will occur in Montreal. The Integrated Circuits Packaging inspection product line will continue to be developed and manufactured in Singapore. The deal is expected to be accretive in fiscal 2009.
(February 29, 2008) Scottsdale, AZ — The IMAPS Global Business Council (GBC) is pleased to announce that Bi Keyun, PhD and president of the China Electronic Packaging Society, will head a delegation from China and will speak at GBC Spring Conference in Scottsdale, AZ, on March 16 and 17, 2008.
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