Besi Restructures and Merges Laurier into Datacon

(February 14, 2008) Radfeld, Austria — Laurier Inc., a division of BE Semiconductor Industries (Besi) and manufacturers of die handling equipment, is now fully integrated into Datacon Technology GmbH die bonding equipment division. The reorganization consolidates Laurier into Datacon, resulting in a single die handling division.

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05/01/2013
Volume 56, Issue 3

Article Archive for Advanced Packaging.

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