The WS-3800 Xpress, RVSI's next-generation model in its WS-Series Wafer Inspection Systems, is said to perform macro-defect inspection on up to 115 wafers-per-hour, offering high throughput while maintaining the same high-resolution, advanced macro-inspection capability as its predacessor. An optional 3D inspection module creates a single platform that accommodates automatic inspection of flip chip wafers at any step in the manufacturing process. Macro inspection speeds are realized through the combination of enhanced camera technology, parallel processing and a new wafer handling system.
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