Package Development Blends Emerging Technologies

(August 1, 2007) SANTA CLARA, CA — Promex Industries, Inc., will use Microbond's (Ontario, Canada) technologies and Mirror Semiconductor's (Irvine, CA) designs to develop advanced, complex packages. Introducing next-generation technologies requires engineering collaborations, said representatives of each company.

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05/03/2012
Volume 55, Issue 4

Article Archive for Advanced Packaging.

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