(March 26, 2007) SINGAPORE — STATS ChipPAC Ltd. developed a fan-in package-on-package (FiPoP) assembly solution that enables designers to integrate a wider range of die sizes than with conventional PoP packages. The FiPoP reportedly builds on the capabilities of PoP, including use of known good die (KGD) and use of the Z space, without the footprint and ball-height constraints of prior designs.
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