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Semicon West
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Photovoltaics
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MEMS
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Displays
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Packaging
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Energy Storage
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Semiconductors
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LEDs
Photovoltaics 2007 P
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04/17/2007 -- Laser System for Flex
The MicroLine UV cuts openings in polyimide coverlayer foils and flex circuits, performing routing, skiving, drilling, pocket cutting, etch/solder-resist structuring, and ceramic substrate micromachining. It suits prototyping and pre-series production environments. -
04/17/2007 -- SolVision Inspects Flip Chip Substrates
(April 17, 2007) BOUCHERVILLE, Quebec — SolVision installed a Nano 3D SX bump metrology system at a flip chip substrate manufacturer based in Japan. The repeat order resulted from the machine's flexibility, support for lead-free bumps, and multi-die-substrate capabilities, said Jean-Lévy Beaudoin, product manager, substrate inspection, SolVision. The machine will be used for flip chip substrate inspection. -
04/13/2007 -- Asymtek Presents Coating and Dispensing Workshop
(April 13, 2007) Carlsbad, CA —Asymtek, a Nordson company, is sponsoring a conformal coating and jet dispensing workshop on Thursday, May 3 at the Doubletree Hotel in Orlando, FL. The workshop will focus on electronics assembly for military and industrial applications and will feature speakers from Dymax, Henkel, Humiseal, Lockheed Martin, and Asymtek. -
04/12/2007 -- Antares Co-brands Gryphics Socket
(April 12, 2007) VANCOUVER, WA; PLYMOUTH, MN; and BEAVERTON, OR — Antares Advanced Test Technologies and Gryphics, Inc., wholly owned subsidiary of Cascade Microtech, Inc., partnered for sales, distribution, and service on Gryphics' LQFN test-socket product line. Antares will rename the sockets "Kalypso," and provide global distribution and service. -
04/12/2007 -- LED Output Increases with 100-mm Dicing
(April 12, 2007) MANCHESTER, NH — A 100-mm sapphire wafer-dicing capability, developed on J.P. Sercel Associates' IX-200 Chromadice DPSS UV laser wafer-singulation system, reportedly increases LED yields by processing larger sapphire wafers than prior methods. -
04/09/2007 -- Invetech Automates Thin-foil Capacitor Production
(April 9, 2007) SAN FRANCISCO — Invetech completed a commercialization project developing high-volume, low-cost processes for prismatic supercapacitor manufacturing. CAP-XX (Sydney, Australia) partnered with Invetech for product development and manufacturing technologies to commercialize the proprietary power-storage devices in mobile telecom, medical, automotive, and industrial markets. -
04/06/2007 -- Cohu Unit Acquires Component Manufacturer
(April 6, 2007) POWAY, CA — Broadcast Microwave Services, Inc. (BMS), subsidiary of Cohu, Inc., purchased Tandberg Televisions AVS GmbH (AVS) for about $8.3 million cash. Cohu supplies test handling, burn-in, and thermal solutions for semiconductor, microwave, and closed-circuit-television equipment markets. -
04/05/2007 -- Cascade Acquires Gryphics
(April 5, 2007) BEAVERTON, OR — Cascade Microtech acquired Gryphics, Inc., a private company, for about 843,000 shares of Cascade common stock and $13.7 million cash. Cascade reported this as a strategic step in expanding its advanced production test consumable for high-performance ICs. This market is less volatile than semiconductor-production capacity equipment, explained Eric Strid, CEO. -
04/05/2007 -- Gartner Reports 23% Growth in Equipment
(April 5, 2007) STAMFORD, CT — Capacity needs, competitive investment in memory, 65-nm ramping, and 45-nm introductions all contributed to a 23% revenue increase in 2006, said Gartner, Inc.'s "Dataquest Insight: Semiconductor Manufacturing Equipment Sales Expanded in 2006." -
04/02/2007 -- Equipment Sales Climb 23% in 2006
(April 4, 2007) SAN JOSE, CA — Worldwide sales of semiconductor manufacturing equipment totaled $40.47 billion in 2006, up 23.1% over 2005. Assembly and packaging sectors grew a total of 14%; test equipment sales increased by 21% over the prior year, according to SEMI's "Worldwide Semiconductor Equipment Market Statistics (SEMS) Report."
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