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Semicon West
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Photovoltaics 2007 P
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09/04/2007 -- Plasma, Thermal Partnership Yields Combined Equipment
(September 5, 2007) PFAFFENHOFEN, Germany — UniTemp GmbH, in partnership with plasma-finish GmbH, developed a semiconductor processing and packaging system that combines plasma and thermal applications. The resulting plasma-temperature processing oven, Model PTP, features a compact chamber and fast ramp rates. -
09/04/2007 -- Semi Dice Named IRC Distributor
(September 5, 2007) CORPUS CHRISTI, TX — IRC Advanced Film, a business of TT electronics, franchised Semi Dice (Los Alamitos, CA) as a global distributor for wire-bondable products. Semi Dice offered the component manufacturer a partner experienced in bare die and the semiconductor industry, said Steve Wade, director, sales and marketing, IRC. -
09/04/2007 -- FCXO for Complex Timing
Vectron
The C3430 frequency controlled crystal oscillator (FCXO) suits wireline and wireless infrastructure, test-and-measurement, and military applications. The component line converts one input frequency to up to four independent output frequencies. -
09/04/2007 -- Thermoplastic Molding
Victrex
T-series TF-60C compound, a proprietary blend of PEEK polymer, Celazole polybenzimidazole (PBI), and carbon-fiber reinforcement, can replace polyimides and metals in semiconductor and electronics assembly. TF-60C is a melt-processable thermoplastic that tolerates harsh environments up to 300°C. -
09/04/2007 -- Environmentally Safe Flux Remover
ZESTRON
An MPC Technology product, VIGON RC 101 cleans accumulated flux residues from ovens and general solder waste from wave soldering machines. The chemistry has no flash point, and removes eutectic and lead-free flux residues. -
09/04/2007 -- Cohu Selects CFO
(September 4, 2007) POWAY, CA — Cohu Inc. named Jeffrey D. Jones as VP of finance and chief financial officer (CFO), succeeding John H. Allen. Allen will retire in November. Jones previously served with Delta Design, Inc., wholly owned subsidiary of Cohu. -
08/29/2007 -- ZESTRON Officially Opens Global Center of Competence
(August 29, 2007) MANASSAS, VA — ZESTRON officially announced the opening of its Worldwide Center of Competence and Excellence for Inline Cleaning. Speedline Technologies, Stoelting and Trek Industries are among the international companies whose state-of-the-art equipment is installed in the new facility. -
08/22/2007 -- Surfect Launches Wafer-bumping Service
(August 24, 2007) TEMPE, AZ — Surfect Technologies, a subsidiary of Surfect Holdings, Inc., launched a wafer bumping service program for IC manufacturers and OEMs performing low-volume production, preliminary wafer-level packaging, R&D, or new product introduction (NPI) in the U.S. The service can also be used to evaluate Surfect's wafer bumping systems The company uses its single-cell electroplating process in 200- and 300-mm format for the service. -
08/21/2007 -- IPC Studies Global Development, Microelectronics
(August 21, 2007) BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries commissioned in-depth market studies on strategies for global expansion and microelectronics trends and technologies. BPA Consulting (Dorking, Surrey, U.K.) and Prismark Partners (Cold Spring Harbor, N.Y.) will conduct the research. IPC's Executive Market Forum oversees the project, and will publish the final reports. -
08/17/2007 -- TDI Ramps InGaN Substrates
(August 17, 2007) SILVER SPRING, MD — Technologies and Devices International, Inc. (TDI), began producing indium-gallium-nitride (InGaN) substrates for packaging GaN-based high-brightness LEDs and blue and green laser diodes. The material's crystal lattice and thermal properties are composed to match the given overgrown GaN device, which can reduce defects, improve device efficiency and output, and boost lifetime and power usage.
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