Ed Ng, GlobalTRONICS organizer, sees RoHS compliance as an additional challenge adding to the standards of "smaller, faster, cheaper" that the electronics manufacturing community follows. He expects that long-term solutions to economic and regulatory problems will be implemented at the design phase, including component selection and test. Research programs will also help manufacturers cope with RoHS restrictions. Ng states that more than half of Singapore-based manufacturers have invested significant amounts in R&D, and are realizing its value for RoHS compliance.
(October 9, 2006) SANTA CLARA, CA — sp3 Diamond Technologies, Inc., and Ceramics Process Systems formed a strategic partnership geared towards electronics packages with enhanced thermal dissipation. The companies will provide aluminum silicon carbide (AlSiC) packages incorporating diamond pins.
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