In the last 10 years, Alagaratnam has helped to establish assembly infrastructures within the industry by developing key process and materials technologies. His keynote presentation will focus on the importance of co-design and co-development. Since the introduction of system-on-chip (SoC) design methodologies, it has become more and more important for package design to develop by using a complete co-design approach including substrate design, bumping, assembly process, and material technologies. Along with co-design, he will discuss the industry's need for finding new ways to share operating costly leading-edge R&D facilities that are needed for packaging technology advances.
(July 20, 2005) San Jose, Calif. — On a three-month average, North American-based semiconductor equipment manufacturers posted $1.07 billion in orders and a book-to-bill ratio of 0.93 in June 2005, according to the June 2005 Book-to-Bill Report published by SEMI.