Towa-Intercon, a developer of manufacturing equipment, develops specialized, advanced-package singulation systems that isolate individual packaged IC from high-density-array processing blocks. This agreement allows AIT to leverage specialized singulation techniques on QFN packages and to maximize its FBGA capabilities. In return, Towa-Intercon will use AIT's Batam facility as an evaluation ground for next-generation equipment technologies and upgrades. This mutually beneficial agreement is designed to help AIT garner higher yields and increase QFN productivity gains.
(January 17, 2005) Washington, D.C. — The International Microelectronics and Packaging Society (IMAPS) and the American Ceramic Society (ACerS) have announced that plans are in place for the First Annual Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), co-located with the ACerS 107th Annual Meeting, Exposition, and Technology Fair, April 10-13, 2005, in Baltimore, Md. A final program has been issued and exhibit sales are well underway.
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