MEI, known for its Panasonic brand, uses Tessera's chip scale packaging (CSP) technology in many semiconductor devices, including application-specific standard products (ASSPs), application-specific integrated circuits (ASICs), and various logic devices. Tessera's CSP has allowed MEI to develop and market consumer products such as digital video cameras and cellular phone handsets with unprecedented feature sets in very small form factors.
(November 15, 2004) Munich, Germany—The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) announces the conclusion of the venture between Amkor, its Unitive subsidiaries, and SECAP to establish the world's first high-volume, 300-mm electroplated solder bumping line using Unitive's technology.
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