ASE Standardizes on Ansoft Solution for IC Packaging

11/05/2004

"Demanding customers like IDM rely on ASE to provide IC packaging solutions. These customers require high-performance package designs that operate reliably up to GHz frequencies," says Dr. Sung-Mao Wu, electrical lab manager at ASE. "We rely on Ansoft products to design these packages and ensure that the electrical performance requirements of our customers are met."

(November 5, 2004) Manhattan Beach, Calif.—Reflecting the changes both in the electronics industry and in the trade show world, IEEE Wescon announces two shows rather than one, serving both the San Francisco Bay area and the greater Los Angeles area annually, instead of the former every-other-year rotation.

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Volume 56, Issue 1

Article Archive for Advanced Packaging.

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