Sharp uses Tessera's technology to package many types of semiconductor devices, such as Flash memory and Flash+SRAM stacked combinations—both markets in which Sharp is considered an industry leader—as well as application integrated circuits and logic devices. Sharp incorporates these semiconductors into a variety of consumer products, including personal digital assistants, digital still cameras, video cameras and mobile handsets.
(August 2, 2004) Atlanta, Ga.—In electronics assembly, 60 to 70% of final defects occur during the stencil printing process (SPP), a stage of surface-mount technology for printed circuit board assembly. Researchers at Georgia Tech's Center for Board Assembly Research (CBAR) have developed a new data-driven, closed-loop control technology that adjusts electronics assembly equipment parameters in real-time, resulting in fewer defects and higher yields.
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