Companies seeking single-wafer solutions for UBM etch are expected to include full-service packaging and test houses, as well as smaller, pure-play bump providers. SEZ's multi-chamber single-wafer wet technology offers these companies advantages for 300-mm printing and plating solder bump applications, as well as seed layer etching for redistribution layers.
(July 13, 2004) San Francisco, Calif.—Leading semiconductor equipment manufacturers expect sales to increase 63 percent this year from the $22.2 billion posted in 2003, according to the mid-year edition of the SEMI Capital Equipment Consensus Forecast. This forecast was released yesterday at the SEMICON West 2004 exposition.
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